Sun UltraSPARC-III Cu
CPU Chip
Company: | Sun (Sun Microsystems) |
Endianness: | bi |
Introduction: | 2003 |
Technology: | 130nm Cu-interconnect CMOS, 16 million transistors |
Word size: | 32/64 |
can be contained in: | Sun Fire 6800 |
can be contained in: | Sun Fire V480 |
can be contained in: | Sun 540-5685 1.2GHz CPU Module (Fire 6800) |
can be contained in: | Sun 540-5859 1.2GHz CPU Module (Fire 6800) |
can be contained in: | Sun 540-6849 1.2GHz CPU Module (Fire 6800) |
cpu architecture class: | RISC (Reduced Instruction Set Computer) |
cpu architecture: | SPARC (Scalable Processor Architecture) |