Sun UltraSPARC-III Cu

CPU Chip

Company:Sun (Sun Microsystems)
Endianness:bi
Introduction:2003
Technology:130nm Cu-interconnect CMOS, 16 million transistors
Word size:32/64
can be contained in:Sun Fire 6800
can be contained in:Sun Fire V480
can be contained in:Sun 540-5685 1.2GHz CPU Module (Fire 6800)
can be contained in:Sun 540-5859 1.2GHz CPU Module (Fire 6800)
can be contained in:Sun 540-6849 1.2GHz CPU Module (Fire 6800)
cpu architecture class:RISC (Reduced Instruction Set Computer)
cpu architecture:SPARC (Scalable Processor Architecture)

24 * Sun UltraSPARC-III Cu

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4 * Sun UltraSPARC-III Cu

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4 * Sun UltraSPARC-III Cu

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4 * Sun UltraSPARC-III Cu

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4 * Sun UltraSPARC-III Cu

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4 * Sun UltraSPARC-III Cu

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4 * Sun UltraSPARC-III Cu

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4 * Sun UltraSPARC-III Cu

instance

4 * Sun UltraSPARC-III Cu

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4 * Sun UltraSPARC-III Cu

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